Open Forum and Pilot Study for the Corporate Innovation Index 3.0

Overview

Background and Objectives

Corporate Innovation Index (CII) is entering its third year of funding under the Hong Kong Government’s Innovation and Technology Commission through the General Support Programme.

Now in its third edition, CII 3.0 continues its mission to build a stronger culture of innovation. The programme is again led by the CUHK Business School’s Asia-Pacific Institute of Business (APIB). Over the next phase, the project will analyse three years of comprehensive longitudinal data to produce practical, action-oriented insights for both corporates and SMEs.

Why Join?

  • Benchmarking: Measure performance against peers and adopt industry best practices.
  • Skill Development: Access training to build practical innovation capabilities.
  • Recognition: Gain industry visibility through formal award programs.
  • Strategic Growth: Leverage data-driven insights and networking to refine innovation strategies.

Date & Time

15 July 2026 (Wednesday)
2:00 PM – 5:30 PM

Venue

Theatre, The Hong Kong General Chamber of Commerce (22/F United Centre, 95 Queensway, Admiralty, Hong Kong)

Language

English

Fee

Free Registration

Rundown

1:30 PM – 2:00 PMRegistration
2:00 PM – 2:05 PMWelcome Remarks
2:05 PM – 2:10 PMOpening Remarks
2:10 PM – 2:15 PMPhoto Session
2:15 PM – 2:30 PMTesting the Metrics: An Inside Look at the CII 3.0 Pilot
2:30 PM – 3:00 PMFireside chat
3:00 PM – 3:45 PMPanel Discussion
3:45 PM – 5:25 PMGroup Discussion: Measurements for CII 3.0
5:25 PM – 5:30 PMClosing Remarks

15 July 2026

2:00 PM – 5:30 PM

English

Cheng Yu Tung Building, CUHK Shatin Campus

Free Registration

*Disclaimer: Any opinions, findings, conclusions, or recommendations expressed in this material / event (or by members of the project team) do not reflect the views of the Government of the Hong Kong Special Administrative Region, the Innovation and Technology Commission, or the General Support Programme Vetting Committee of the Innovation and Technology Fund.

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